Sentence examples for light etching from inspiring English sources

Ti conical islands were fabricated by coating photoresists on Ti foils, stacking dot-patterned photomasks on the photoresists, illuminating with UV light, etching the surface with the RIE method, and stripping the photoresist.

Ti-protruding dots with a cylindrical shape were fabricated by coating with a photoresist, illuminating with UV light, etching the Ti surface via the RIE method, and stripping the photoresist on Ti foil.

Arrays of the Ti-protruding dots were prepared by photolithography, which consisted of coating the photoresists, attaching a patterned mask, illuminating with UV light, etching the Ti surface by reactive ion etching (RIE), and stripping the photoresist on the Ti foil.

The substrate surface was light etching by hydrofluoric (HF) acid for 10 min at room temperature after standard cleaned process to prepare -H terminals on the substrate.

With the light-etching method, the smallest part of a semiconductor is currently 32 nanometers, and the nanotechnology is an approach that both Intel and I.B.M. have high hopes for by the time semiconductor parts are down to seven nanometers — which could be as early as 2017.

The lighter etchings were probably added later.

In "U.S. 91" a shaft of light shoots straight down from the sky to the ground, glinting off the tops of three crosses and delicately etching in light the wild plants in the picture's foreground.

Transmittance and reflectance spectra of thin μc-Si film before (light-grey) and after etching to form nanostalagmites (black) were shown in Figure 4a.

Our burg is looking so festive, with twinkling lights of all colors etching houses and trees.

Astronauts in space-planes built from light-weight moon-materials etching laser doodles onto England's green and pleasant land = authentic crop circles.

Conventional methodologies have been well established for n-type porous silicon (nPS) fabrication, and the preferred method requires light-assisted etching (back/frontside) to photogenerate valance band holes necessary for silicon dissolution [9]; nevertheless, it is a depth-limited process (light cannot penetrate through to the bottom layers).