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The lifetime decreased by 13.1% after the UV exposure test.
While in the presence of Au NPs, the lifetime decreased to 6.8 ns.
The lifetime decreased with increasing the amount of deposited V2O5 salt.
With increasing total strain amplitude both plastic strain amplitude and mean stress increased and the fatigue lifetime decreased.
With increasing roughness Ra of the bond coat, the weight gain increased evidently during thermal cycling and the lifetime decreased.
After annealing at 450°C and for 10 min at ambient air, effective minority carrier lifetime decreased firstly and then increased with the increasing of square resistance.
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At some point, however, the network lifetime decreases again.
Hence, the lifetime decreases when the number of sources increases.
LCF lifetime decreases as HHF load is increased or coolant temperature is decreased.
When the number of nodes is 200, network lifetime decreases as the packet loss ratio increases.
However, as the number of nodes increases, the system's lifetime decreases rapidly.
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