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The high interfacial shear stress calculated, about an order of magnitude higher than micro fiber reinforced composites, is believed attributed to intimate contact between the two solid phases at the molecular scale.
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More importantly, seams or gaps resulting from irregularly shaped MCD grains were found to be terminated by UNCD growth, which is believed to attribute to the lateral growth mechanism of UNCD.
In a previously reported CMG2 structure, the metal ion-coordinating residues of CMG2 adopted the open state with an acetate molecule as a mimic ligand, and such an open form is believed to attribute to the higher affinity of CMG2 towards PA [10], [14], [21], [22].
The Pew Research Center has released its newest study revealing that the U.S. public is becoming less religious, which is believed to be attributed to the growing amount of "nones," that is, those that do not claim to belong to any certain religious tradition.
The improvement of the wear resistance is believed to be attributed to the reinforcement phase of TiC which can also provide high hardness according to the microstructure observation of the composite coatings by SEM, EDX and microhardness measurements.
The good deformation ability is believed to be attributed to the initial fine microstructure derived from the P/M route.
The enhancement is believed to be attributed to the strong interfacial interactions between DC-GR and the matrix via epoxy groups.
This deviation beyond a certain temperature is believed to be attributed to their incorrect postulation implied in determining the Nusselt number, as previously noted.
The significantly higher J c for the sample with sharper texture is believed to be attributed to improved GB misorientation angle distributions.
The enhancement of photoresponsive current of CuInS2 film is believed to be attributed to one-dimensional single crystalline nature of CuInS2 nanoleaves.
The improvement is believed to be attributed to the lower surface interfacial energy when reinforcements are added [34]. Figure 6 Improvement in the wettability of solder with Ni-CNT.
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