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"Demand for high-speed interconnects is strong," he says.
Research in reliability of interconnects is increasingly important as interconnects are constantly shrinking in dimensions.
The evolution of stress affected by the formation of voids in metal interconnects is studied numerically.
In this paper, reliability of Through Silicon via (TSV) interconnects is analyzed for two technologies.
The spacing between two interlayer interconnects is S, and the thickness of the interlayer-dielectric is Tox.
The methodology of materials analyses of the metallurgy of the wire bond interconnects is described.
Similar(28)
Communication interconnects are moving down that same path.
However, QDI interconnects are vulnerable to faults.
Suggestions on making immortal strained interconnects are made.
The polarization resistance for cobalt-coated interconnects was 0.92 Ω cm2 and for uncoated interconnects was 5.1 Ω cm2.
Today, the dedicated interconnects are coming out of beta and are getting a few new features.
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Justyna Jupowicz-Kozak
CEO of Professional Science Editing for Scientists @ prosciediting.com