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A review has been made on various aspects of interconnection technology in microelectronics industry.
General distributed computing and control architecture for ISMA is presented, SpaceWire high-speed interconnection technology for its implementation is considered.
Die-to-package interconnection processes and reliability issues have also been discussed along with future developments in the field of interconnection technology.
Overall, the wireless infrastructure will continue to evolve with the drive from advancing VLSI and interconnection technology, as well as standardization efforts in the new wireless interface.
Multilevel metal/dielectric interconnection technology strongly impacts chip size and performance, and plays an important part in chip cost, yield, and reliability.
Reliability and functionality of microelectronics products utilizing advanced packaging approaches, i.e. flip chip interconnection technology, chip scale or wafer level packaging, largely depend on their mechanical and thermal constitution.
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Hadco, based in Salem, N.H., is one of North America's largest makers of printed circuit boards and specializes in interconnection technologies.
Optical interconnection technologies are increasingly deployed in high-performance electronic systems to address challenges in connectivity, size, bandwidth, latency, and cost.
The paper also reviews interconnection technologies in these assemblies and presents a comparison of their concept, cell type, joint type, manufacturing techniques and production status.
With report that 40.7% of this type of PV module fails at interconnection coupled with recent reports of increase in such failure in the tropics, the review of interconnection technologies employed in crystalline silicon solar cells manufacture has become imperative.
Therefore, in parallel with the search for better conductors and insulators as well as improved interconnection technologies, there is an urgent need to address the interconnection issue from the circuit design perspective.
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