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In this paper, an on-chip interconnection scheme called Heterogeneous IP Block Interconnection (HIBI) is presented.
The proposed technique inlines flexibility into custom carry-save (CS) arithmetic datapaths exploiting a stable and canonical interconnection scheme.
These parallel systems require a cost-effective yet high-performance interconnection scheme to provide the needed communications between processors.
Its implementation encompasses a large number of cores and an advanced interconnection scheme such as a Network-on-Chip (NoC).
With the presented interconnection scheme, bus efficiencies greater than 90% have been achieved in several test cases.
In this design, an important fact to consider is that this interconnection scheme must be efficient that is, they must move large amounts of data quickly, with little expended energy, and they must be economical.
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However other simpler, and higher through-output interconnection schemes are possible.
Conventional interconnection schemes may experience increasingly severe data congestion as SOC complexity spirals ever upwards.
Among them, the multi-wires interconnection schemes are shown to have a dramatic impact on metallization design and technology.
Modern FPGAs provide the capacity to build a variety of micro-architectures composed of 20-50 procomplex, comemorymemory hierarchies, heterogeneous interconnection schemes and custom co-processors for performance critical operations.
In this paper, the effect of uniform and non-uniform shading scenarios on the output of solar photovoltaic modules of different interconnection schemes has been investigated.
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