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Then in the spirit of design rules, we investigate a multilevel interconnect test structure to avert channeling cracks caused by differential thermal expansion.
Oxygen-based ash chemistries were found to damage the physical and electrical properties of the material (lower barrier integrity, lower dielectric breakdown field, higher leakage) as well as the reliability of interconnect test structures (lower lifetimes) whereas nitrogen-based chemistries enhance these properties.
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Two analog test buses are employed to deliver test stimuli and test responses in board-level analog interconnect testing and passive component measurement.
A case study on the New York-New England interconnected test system, which exhibits multiple inter-area oscillatory modes, demonstrates the viewpoint and effectiveness of the proposal in providing satisfactory overall system damping performance over a large number of operating conditions.
A method is presented for significantly reducing the interfacial contact resistance of single-walled carbon nanotube (SWCNT) interconnects test-structures.
Subsidiaries of Aeroflex provide microelectronic modules, integrated circuits and interconnect and testing solutions for communications, and design and manufacture motion-control systems and shock and vibration systems.
The results so far let Intel boast of a chip that, thanks to the company's manufacturing prowess and the work by QuTech, has considerably improved in reliability and performance over the last two years, while the architecture, system infrastructure (such as interconnects and testing methods) and so on have evolved alongside.
1 Not adjusted by waist circumference since BMI and WC strongly interconnected (χ-test, p < 0.001). 2 Compared to age-mates.
This can be considered as a low-entity difference (less than 2-fold) when compared to the possible large prediction errors performed when pre-characterized modules are interconnected and tested [ 6, 15, 18, 39].
This basically gives a delta of -300 °C, which accounts for deposition/recrystallization-anneal conditions of copper interconnect and the test condition.
The performance of the interconnect has been tested on different platforms and architectures using MPI.
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Justyna Jupowicz-Kozak
CEO of Professional Science Editing for Scientists @ prosciediting.com