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The right column shows the interconnect structures after releasing the applied strain.
The proposed MEMS components include microvalves, pressure sensors, mechanical interconnect structures, and electrical routing.
A testing technique based on cross-sectional nanoindentation has been used to assess the mechanical reliability of interconnect structures.
For these interconnect structures, the interplane via locations are obtained both through geometric programming and near-optimal heuristics.
The local interfacial strength is a key factor in designing and fabricating advanced three-dimensional large-scale integration interconnect structures.
Crack propagation in BEoL (back-end of line) interconnect structures is a concern in terms of chip reliability.
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Gelatos, A. V. & Fiordalice, R. W. Process for forming copper interconnect structure.
Nearly all materials in the on-chip interconnect structure have been changed in recent years.
The three-dimensional interconnect structure is constructed by reduced graphene oxide and single-walled carbon nanotube, and Mn3O4 nanoplates with pesudocapacitance are embedded into the interconnect structure.
This mechanical failure mode is caused by delamination of several layers of the interconnect structure.
A novel interconnect structure, specifically designed for long-term durability, is briefly discussed.
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CEO of Professional Science Editing for Scientists @ prosciediting.com