Sentence examples for interconnect structure and from inspiring English sources
An image of an assembled probe (Fig. 2i) highlights the electrical connection and microlever support; a zoom of the tip region (Fig. 2j) shows the nanowire/SU8/metal interconnect structure and protection cap of the probe end.
The regular interconnect structure and a synergetic effect between graphene oxide/single-walled carbon nanotube and Mn3O4 make the Mn3O4/reduced graphene oxide/single-walled carbon nanotube flexible film electrode exhibit a large areal capacitance of 796 mF cm−2.
Depending on the initial stress profile within the interconnect structure and the current flow direction, the threshold required to nucleate void can be rapidly reached under undesired conditions.
The proposed MEMS components include microvalves, pressure sensors, mechanical interconnect structures, and electrical routing.
The results examine the relationship between the interconnect structures and thermal stresses in SOFC at certain mechanical properties.
The method should be generally applicable to a wide range of interconnect structures and will find utility in the design of stress migration tolerant designs as well as in failure analysis.
Antifuse-based FPGAs offer several advantages such as nonvolatility, naturally "rad hard" interconnected structure, and their configuration data is buried deep inside them.
The outstanding electrochemical performance of the 3D SnS/C is ascribed to its 3D porous carbon interconnected structure and nanoconfined SnS nanoparticles distributing broadly in carbon matrix, which not only improve the conductivity, but also keep the structure integrity, and as a result of enhancing the cycling stability of the material.
The three-dimensional interconnect structure is constructed by reduced graphene oxide and single-walled carbon nanotube, and Mn3O4 nanoplates with pesudocapacitance are embedded into the interconnect structure.
The finite element method is employed to model the thermal and voiding histories of the interconnect structure.
Gelatos, A. V. & Fiordalice, R. W. Process for forming copper interconnect structure.
