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The three-dimensional interconnect structure is constructed by reduced graphene oxide and single-walled carbon nanotube, and Mn3O4 nanoplates with pesudocapacitance are embedded into the interconnect structure.
This mechanical failure mode is caused by delamination of several layers of the interconnect structure.
The process conditions, materials used, processing temperatures etc., cause tensile or compressive stress in the interconnect structure.
A novel interconnect structure, specifically designed for long-term durability, is briefly discussed.
The finite element method is employed to model the thermal and voiding histories of the interconnect structure.
This is similar to the observations of Yung et al. for large-scale CNT to CNT interconnect structure which demonstrated that the bonding process is reworkable [11].
Similar(42)
The proposed MEMS components include microvalves, pressure sensors, mechanical interconnect structures, and electrical routing.
Stress-induced voiding, hillock formation, and electromigration are some of the prominent reliability concerns for interconnect structures (Suo 2003).
A testing technique based on cross-sectional nanoindentation has been used to assess the mechanical reliability of interconnect structures.
For these interconnect structures, the interplane via locations are obtained both through geometric programming and near-optimal heuristics.
The local interfacial strength is a key factor in designing and fabricating advanced three-dimensional large-scale integration interconnect structures.
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Justyna Jupowicz-Kozak
CEO of Professional Science Editing for Scientists @ prosciediting.com