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Copper direct bonding technology is considered to be one of the most promising approaches for matching the miniaturization needs in future tridimensional integrated high performance circuits (3D-IC).
This device has a console, an L-shaped hand-piece with an integrated high performance electrical motor, and a microneedle module which reaches between 50 and 150 pulses per second through electrical pulses (300 900 per second).
The suggested unit serves as universal basis for high-level image processing implemented on programmable chips, which enables a new generation of integrated high performance embedded vision systems maintaining reasonable system costs due to design reuse of basic units.
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To overcome the limitations of conventional steel stay cables in a thousand-meter scale cable-stayed bridge, hybrid basalt and carbon (B/C) FRP cables were investigated to achieve integrated high performances in the bridge of this scale as a replacement for steel cables.
Telecommunication and multimedia applications require highly integrated, high-performance systems, where analog, RF, and digital components must be efficiently packaged into a single chip.
We have developed a fully integrated, high-performance software system, AGeS, which annotates genomic sequences and assigns function(s) to the predicted protein-coding regions for completed and draft bacterial genomes.
This will be the first software available on the market for operators to integrate high-performance cloud services to utilize distributed optical sensing data in integration with other data streams.
The critical missing link to functional embodiments of these concepts is the ability to directly integrate high-performance ferroelectrics or multiferroics with high-performance semiconductors.
This investigation examines a means of integrating high-performance ZnO piezoelectric thin films with a flexible stainless steel substrate (SUS304) to fabricate a double-sided piezoelectric transducer for vibration-energy harvesting applications.
The computer software architecture of PrintingSolutions.com, the related websites, and the design/order processing technologies integrate high-performance and proprietary software modules with technology that is licensed from third parties.
Wen, Y. et al. Integrated high-performance infrared phototransistor arrays composed of nonlayered PbS MoS2 heterostructures with edge contacts.
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