Er represents a balance between Young's modulus of the sample, Es, and that of the indenter, Ei, because both the sample and the indenter experience elastic deformation during the indentation process: 1 E r = 1 − v 2 E + 1 − v 0 2 E 0 (13).
Because both the sample and the indenter have elastic deformation during the indentation process, the reduced modulus E r is defined by 1 E r = 1 − v s 2 E s + 1 − v i 2 E i (11).
The two-dimensional finite element model is used to simulate the indent formation process during single impaction.
Three-dimensional (3D) MD simulation models are constructed to study the indentation processes on single-crystal copper by a half-cylinder diamond indenter.
The indentation unloading process is well described by the loading process of a conical indenter with the effective face angle of βeff(=β−βr) pressed into a flat elastic half-space, in which the inclined face angles of the indenter used and of the residual hardness impression formed are defined by β and βr, respectively.
Since micro and nano hardness test conventionally use a conical indenter while the wirebond process experiences a spherical indentation, a comparison is made in terms of the force-indentation depth graphs.
Chang et al. [39 45] have suggested that the smaller diameter nanowires could not provide sufficient elastic force to resist the pressure from the indenter in the unloading process, yielding the lower contact stiffness, resulting in the lower modulus.
The results show numbers of genes annotated to each process or family (indent) and corresponding p-values (as calculated by MapMan Wilcoxon rank sum test) according to the MapMan gene ontology.
The results are part of the MapMan gene ontology showing numbers of genes annotated to each process or family (indent) and corresponding p-values (as calculated by MapMan Wilcoxon rank sum test).
The cup center will indent slightly during the cooling process.
