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All the blends displayed single but increasing glass transition temperature with increased PVAc concentration.
By increasing glass microdevices' applications, the necessary, low-priced, simple and flexible microstructuring techniques have vastly increased.
The increasing glass transition temperature (Tg) of blends, as they become richer in P4HS, was the cause of this dependence.
The copolymers with higher LA fraction showed decreasing melting point from 160 to 125 °C, but increasing glass transition temperature from 7 to 27 °C.
Glass powders with different particle size distributions were tested; coatings with increasing glass volume fractions (0%, 20 %, 40 %, 60 %, 80 %, 100ere sprayed.
Results indicate increase in workability with increasing glass powder content while there is decreasing trend in workability with increasing steel slag content.
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Photocrosslinked PET copolymers show increased glass transition temperatures and broadening of melting transitions.
The TPUs exhibited increased glass transition temperature, moduli and tensile strength values, demonstrating that they were hard and tough elastomers.
The increase of PEI concentration increased glass transition temperature and eliminated the neck formation while decreasing crystallizability.
Those grafted PLA chains exhibited significantly increased glass transition temperature and thermal stability, compared with pure PLA.
The addition of CNC_a increased glass transition temperature (Tg) of epoxy while CNC_h and CNC_d led to Tg depression.
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