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One of the promising methods is to use crossbar architecture to increase integration density.
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Rapidly increasing integration density in modern miniaturized microelectronic and optical devices stimulates the demands for low-power and fast-response on-chip refrigeration solutions.
With the miniaturization of electronic devices and the increased integration density, the effective dissipation of heat becomes an important requirement for ensuring trouble-free operation [1, 2].
Studies on the crosstalk between adjacent waveguides reveal the ability to increase the integration density by ∼2 times compared with the traditional metal insulator metal slot waveguide.
Miniaturization is the most important issue not only to increase device integration density but also to improve FET performance for complicated operations.
Embedded systems are growing more and more complex because of the increasing chip integration density, larger number of chips in distributed applications, and demanding application fields (e.g., in cars and in households).
System integration density increased tremendously in recent years, resulting in various problems for designers.
As integration density of interconnect increases at every technology node, increased delay and crosstalk become more challenging design issues particularly for subthreshold interconnects.
Besides, as the integration density of interconnects increases, crosstalk issues will be the concerns.
However, while the performance increases due to scaling, the power density increases substantially every generation due to higher integration density.
Recently the cell integration density of NAND flash memory is increasing rapidly due to its simple structure, which is suitable for high resolution lithography.
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