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It is interesting to note that the porosity slowly moves towards the grain boundary edges and vertices, which is energetically favourable due to the increase in interfaces.
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The reduction in SBH is caused by an increase in interface state density at the MS interface induced by SHI irradiation.
However, it is noted that the significant increase in interface state density (Dit) occurs only if the Ge concentration at the oxide interface is high enough (∼1.8×1022 cm−3).
The grafting resulted in an at least fivefold increase in interface-binding strength between the hydrogel and the thermoplastic polymer material.
The results also indicate that an increase in interface gap causes an increase in strength loss during the transition region of the stress strain curve as a result of the delayed activation of the FRP shell.
Figure 1 shows the pictorial representation of increase in interface residues (number of interface charged residues in bins) when the distance cutoff is increased gradually, in bins, from 7Å to 15Å.
It is suggested that there is an energy increase in the interfaces between matrix and persistent slip bands (PSBs), GBs and TBs per cycle during cyclic deformation due to the accumulation of lattice defects, which would make the interface unstable.
The observed trend of increased hydrophobicity in interfaces compared to non-interacting surface patches [ 5, 195- 197], as well as the proposed pattern of a highly hydrophobic central region surrounded by polar residues [ 71, 198], has been used with success in several recent predictors [ 8, 33, 37, 40, 75].
Under the TLP stress condition, the increase in the interface trap charge concentration at Si-SiO2 intenhancesnhances the carrier scattering which in turn reduces the carrier mobility and channel current, thus Ron rises and gm decreases as observed in Figure 6.
Moreover, an increase in the interface parameters decreases the stress intensity factors.
It is found that a single-phase layer forms and increases in thickness monotonically with time during the holding period with a corresponding increase in the interface temperature.
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