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The gelatin layer was visible in the interconnections of the pores in the coated scaffold [Fig. 3c].
A lot of dynamical systems have variable structures subject to stochastic abrupt changes, which may result from abrupt phenomena such as stochastic failures and repairs of the components, changes in the interconnections of subsystems or sudden environment switching.
The systems have variable structures subject to stochastic abrupt changes, which may result from abrupt phenomena such as stochastic failures and repairs of the components, changes in the interconnections of subsystems, sudden environment changes, etc.
Over the past decades, the stochastic jumping neural network (SJNN) has been widely investigated due to random changes in the interconnections of dynamic network nodes, and many works have been devoted to the study of SJNN [6 8].
A lot of difference systems have variable structures subject to stochastic abrupt changes, which may result from abrupt phenomena such as stochastic failures and repairs of the components, changes in the interconnections of subsystems, sudden environment changes, etc.
Markovian jump systems (MJSs) involve both time-evolving and event-driven mechanisms, which can be employed to model abrupt phenomena such as random failures and repairs of the components, changes in the interconnections of subsystems, sudden environment changes, etc.
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The present review is focused on most recent studies, in which the interconnections of interfacial layer and foam film properties are innate for the performance of the respective systems and have been clarified to highest possible degree.
Small variations in phenotype arise in part because the interconnections of metabolic pathways in the organism are so complex that variation in proteins that are not directly part of the melanin production pathway may nevertheless have an effect on the rate of melanin formation.
From the electric standpoint, the power module reduces parasitic elements in the interconnection of the power semiconductor devices due to the tight physical integration.
Emphasized in the interconnection of pattern and process, this study provided an ecosystem health approach to assessing the integrated ecological effects of regional land use change.
Chip-on-film (COF) is a new technology after tape-automated bonding (TAB) and chip-on-glass (COG) in the interconnection of liquid crystal module (LCM).
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