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Although a new design approach such as NoC is required to get a more process independent interconnection architecture, still more emphasis is put on the physical design of interconnection and more detail understanding of the physics in the interconnect of deep submicron (DSM) technology is required than before.
Voids and cracks often occur in the interconnect lines of microelectronic devices.
Atomic layer deposition (ALD) has sparked a lot of interest in the interconnect world for a number of reasons.
The 1.6 mm diameter gaskets were fitted into machined channels, 1.5 mm deep in the interconnect plates.
The recent paradigm shift in the interconnect architecture of computing systems can provide opportunities for optical interconnect technology.
The crack lengths obtained for different material systems in the interconnect structure correlate well with the fracture energies measured for the same materials in blanket films.
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Mary Jo White, Chair of the Securities and Exchange Commission, Remarks at International Bar Association Annual Conference (Sept . 21 , 2016 available at https://www.sec.gov/news/speech/securities-regulation-in-the-interconnected-global-marketplace.html.html
Mary Jo White, Chair, Sec. and Exchange Comm'n, Keynote Remarks at the International Bar Association Annual Conference (Sept . 21 , 2016 https://www.sec.gov/news/speech/securities-regulation-in-the-interconnected-global-marketplace.html.html
Voids and cracks may occur in the interconnects, causing a severe increase in the total resistance and even open circuits.
The combined effects of current densities and temperature in the interconnects may cause the failure of a circuit due to electromigration (EM).
A through-open-short-match (TOSM) calibration is used to account for loss and phase offsets in the interconnecting cables.
More suggestions(17)
in the interconnectedness
in the interface
in the interconnector
in the networking
in the interconnectivity
in the interlock
in the interconnection
in the interlinking
in the interconnecting
in the network
in the tier
in the interlinked
in the connections
in the interconnected
in the linking
in the interfaces
including the interconnect
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