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Unfortunately, plasmid instability was observed in the first process.
In the first process, cutout pieces are glued to a support.
In the first process, the reactants are progressively heated from room temperature up to 1600 °C.
In the first process step laser radiation is applied to generate microstructures on the surface of the metallic joining partner.
In the first process called conventional process (CP), the oxygen flow rate was kept constant during the deposition duration.
In the first process, S/O/W1 viscous emulsion is prepared by dropping of S/O phase in the first water phase (W1).
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In the second process the bundles were densified by CVI processing only.
In the second process, ethyl lactate was discharged from the bottom of the reactive distillation column.
In the second process of separation, the demulsifier FC20 was applied.
In the third process scheme, RNA and endotoxin were first removed from alkaline cell lysate by ZnCl2 precipitation.
On the other hand, the oxygen flow rate was pulsed in the second process called reactive gas pulsing process (RGPP).
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