Sentence examples for in plating from inspiring English sources

Exact(60)

For all experiments, data were normalized to the untreated conditions to consider variations in plating efficiency.

It chiefly af fects welders, smelters and other metallurgic workers ex posed to cadmium in plating processes.

These improvements are largely due to better understanding of tissue requirements, an increased use of free tissue transfer, and advancements in plating systems.

After cell attachment in plating media, differentiation media was added (low glucose DMEM, 10 μg ml−1 insulin, 10 ng ml−1 biotin, 50 nM hydrocortisone, 0.5% N1-mix).

In these cases, even a moderate reduction in plating efficiency may result in lack of mutant recovery, resulting in categorization of the gene as "essential" in a large-scale, genome-wide mutagenesis.

For de-agglomeration, Hexa decylpyridinium bromide (HPB) was used in varying quantity in plating bath as surfactant.

It was found that adding brightener in plating bath has a great effect on the cyclic voltammogram and galvanostatic measurements during the electrodeposition.

Among all composite coatings, however, Ni P Al2O3 produced from 1.0 g/L Al2O3 in plating solution exhibits higher impedance values at low and intermediate frequencies.

Ni-P coated diamond (NPCD) with different phosphorus content was prepared by electroless plating through adjusting NaH2PO2 concentration in plating bath.

The expected number of mutations per culture (m) and 95% confidence intervals were calculated using the maximum likelihood estimator applying the newton.LD.plating and confint.LD.plating functions that account for differences in plating efficiency implemented in the package rSalvador (http://eeeeeric.com/rSalvador/) (Qi Zheng. Rsalvador: an assay. R package version 1.3) for R (www.R-project.org/).org/

The quantity of adipate incorporated into NiP coatings decreases with increase in hypophosphite and citrate concentrations in plating solution, similarly to the quantity of adipate adsorbed from corresponding solutions without Ni II) on a freshly plated NiP surface.

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