Sentence examples for implementation of thin from inspiring English sources
This paper presents a comprehensive procedure for the design and implementation of thin film heaters manufactured on glass substrates.
Therefore the implementation of thin low-resistance metallic grids onto transparent contacts is a crucial development aspect for large-area OLED design.
These results could open great opportunities for the implementation of thin AZO/Ag/AZO electrodes on large-area modules liable to segmentation, such as for α-Si H solar panels.
The concept of multi-scale architecture in the TF-SOFC not only enables the reliable implementation of thin-film electrolytes and nanostructured electrodes to improve the critical low-temperature performance of the SOFC but also secures the thermo-mechanical stability of TF-SOFC.
In this paper we explore the possibilities of implementation of triangular thin-film photovoltaic modules.
We present the implementation of a new thin silicon microneedle for deep brain drug infusion implemented using a fabrication technology called glass cover on silicon technology (GCoS) that embeds microchannels in silicon substrate.
High-voltage particle detectors in commercial CMOS technologies are a detector family that allows implementation of low-cost, thin and radiation-tolerant detectors with a high time resolution.
To overcome the aforementioned drawback, two main techniques that have been reported in the literature are used sequentially: (a) implementation of Cr or Ti thin intermediate layers, usually by radio frequency (RF) sputtering and then (b) thermal annealing of the composite Cr(Ti /Au layer.
The results demonstrate a successful implementation of the concept of sideways deposition of thin films providing a solution for coating complex shaped surfaces.
However, these polymers are synthesized through solution-phase reactions to yield insoluble and unprocessable solids, which preclude not only the evaluation of their conducting properties but also the fabrication of thin films for device implementation.
With the implementation of Cu interconnect technology, the conventional thin film deposition technique including physical vapor deposition (PVD) shows its fundamental limitation with 65 nm technology node and beyond and the need for introducing metal thin film deposition technique with excellent conformality and controllability of thickness at nanometer scale has been increased.
