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Three-dimensional integrated circuit (3D IC) is a promising technology in today's IC packaging industry.
3D IC packaging offers miniaturization, high performance, low power dissipation, high density and heterogeneous integration.
The proposed methodology is illustrated through a practical application from an IC packaging company.
The proposed method is illustrated in a practical application scenario involving an IC packaging company.
A real example of IC packaging process is given to illustrate the model application.
An introduction to the exciting and continuously growing topic of IC packaging is presented herein.
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