This investigation deals with the modelling of semiconductor device having very high drain current and conductivity.
Yang, L. et al. High-performance MoS2 field-effect transistors enabled by chloride doping: record low contact resistance (0.5 kΩ·μm) and record high drain current (460 μA/μm).
It is found that doping of Gallium and Aluminum in scattering region provides higher drain current, higher ION/IOFF and IP/IV ratios as compared to that of Boron doped zigzag GNR FET.
Further, a back-gate graphene field-effect transistor fabricated on the Ar+-ion-cleaned graphene surface showed about 4 times higher drain current than that showed by a similar transistor fabricated on pristine graphene.
In SGDM-EDTFET architecture, the reduction in gate length results a significant improvement in the tunneling current due to occurrence of strong coupling between gate and channel region which ensures higher drain current sensitivity for detection of the biomolecules.
Very high drain current of 6.7 mA/μm, low DIBL of 1.62 mV/V, high Ion/Ioff ratio of 4.044e107, low delay of 0.001 ps and low EDP of 1.37e−31 J s/μm are obtained for DGM DG device.
The work highlights major improvements over conventional TFET in terms of lower subthreshold swing and threshold voltage, higher drain current and transconductance, improved on-to-off current ratio, suppressed ambipolar conduction and improved dynamic power dissipation issues for low voltage analog and digital applications.
The integration of black phosphorus with junctionless recessed channel MOSFET, leads to higher drain current of about 0.3 mA and excellent switching ratio (of the order of 1011) due to reduced off-current which leads to improvement in sub-threshold slope (SS) (67mV/dec).
The analog/RF performance is compared between the proposed design and a conventional DGJ MOSFET of similar dimensions, where the proposed device shows excellent ability in improving the analog/RF performance and provides higher drain current and improved figures-of-merit as compared to the conventional DGJ MOSFET.
The optimum design of channel length (i.e. L = 10 μm) can provide enough space for the lateral growth of large ZnO grains with less channel defects and bring about the advanced device characteristics (i.e. the positive threshold voltage of 3.0 V, mobility of 9.03 cm2/V·s, on/off current ratio > 106, gate leakage of < 1 nA with less fluctuation, and extremely <span class="lh lhl">high drain current > 500 μA).
