Compact thin film thermoelectric generators can accumulate the high-density heat flux from the LED chip and convert it into usable electrical power.
Loop Heat Pipes (LHP) and Heat Pipes (HP) are used in the thermal management of electronic devices with high-density heat dissipation.
This evolutionary direction is further illustrated by the evolution of cooling technology for high-density heat transfer, from natural convection to forced convection and pure conduction, Fourier and non-Fourier.
Due to their favorable thermo-dynamical characteristics, such as high density, specific heat and latent heat of fusion, PCMs are usually employed as working fluids for thermal storage.
Loop heat pipes (LHPs) and other two-phase heat transfer devices are used in the thermal management of electronic devices with high density of heat dissipation.
Water-cooled micro/minichannel heat sinks are an important component in managing the temperature of electronic components, particularly where high density of heat rejection is required.
ILs have excellent thermophysical properties such as good thermal and chemical stability, high density and heat capacity and negligible vapor pressure.
In order to achieve the high energy density, heat and mass transfer networks have to be optimized.
However, it is difficult to use helium gas as a coolant to carry away a high power density heat regime due to its low heat-carrying capacity.
Maizza and Maizza[16] suggested that high latent heat, high density, and low liquid specific heat are preferable.
It is difficult to find the best fluid, which has simultaneously high cycle efficiency, low vapor specific volume at turbine outlet, super-atmospheric saturation pressure, high latent heat, high density and low liquid specific heat, low environmental impact, low toxicity, and has non-combustion characteristics.
