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In a compression test the surface is closed under high compressive stress, thus repeatedly blocking the process, but in a tension test the surface separates more easily, causing loss of plastic stability.
Dark blue areas show areas of high compressive stress.
This up shift evidences that FLGs experience a high compressive stress.
Naturally, in both conventional hyrax simulations, these areas manifested high compressive stress levels.
High compressive stress concentrations are found to exist at the four square corners.
For high compressive stress during growth, required for thick GaN layers, plastic substrate deformation can occur.
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Not surprisingly, high compressive stresses are seen around the points of force application (Figure 12).
The high compressive stresses in the internal layers yield a pronounced R-curve behaviour in the laminates.
The third principle stress distribution plots display high compressive stresses around the zygomaxillary buttress nodes and averaged −15.73 kg/mm2 (Figure 16).
The indentation toughness results showed that with increase of substrate roughness there is an increase in interfacial toughness due to high compressive stresses associated with high rough surfaces.
The result verified the high compressive stresses at the surface which rapidly changes to tensile stresses in the transition zone resulting in a large tensile stress peak.
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