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The rising heat dissipation problem in electronic devices has led to numerous investigations on microchannel heat sink.
The experimental results have guiding significance for solving heat dissipation problem of high heat flux electronic devices with multi-heat sources.
The optimal design scheme of the "+" shaped HCC with minimum EDR can be adopted in the heat dissipation problem of the electronic device to improve its GHCP.
One of their concerns is whether these various shapes would incur more difficulties in the airflow and thereby, would intensify the condenser heat dissipation problem.
This study primarily investigated the heat dissipation problem in light-emitting diode (LED) lighting, designed and improved the structural designs of lighting devices of LED bulbs, and employed composite materials as the lighting structural material.
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The most important consideration in the design of future high-capacity routers will be energy consumption and the associated heat dissipation problems.
Heat dissipation is increasingly a difficult problem for companies looking to create customized hardware for machine learning.
But the heat dissipation is still the major problem of enhancing the thermal performance the heat sink.
As industrial and technological products demand higher standards of function and capacity, the problem of heat dissipation from electrical appliances becomes a significant issue.
As technology and energy products require higher standards of function and performance, the problem of heat dissipation is becoming a significant issue in many appliances.
When microprocessors are getting more and more powerful, low power design is needed to relieve the problem of heat dissipation as well.
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