Sentence examples for free temperature from inspiring English sources
The Cu interconnect structures were assumed to be cooled from the stress free temperature 400 °C to the testing temperature or use condition of 100 °C, similar to (Rhee et al. 2003).
In Table 6 significant impact is involved in heat flux (-theta'(0)) and free temperature (theta(1)), by increasing the values of Prandtl number Pr will decrease the film thickness (beta^{2}=Upsilon) and heat flux (-theta'(0)) while, the skin friction (f 0)) and free temperature (theta(1)) increases for the case (K=0.1) and for (K=0.3) similar pattern are investigated in Table 6.
This leads to formation of thermally induced stress σ th, as in {sigma}_{mathrm{th}} = mathrm{E}varDelta alpha varDelta mathrm{T} (2 where, E is appropriate elastic modulus, ∆α is relative coefficient of thermal expansion of the material, and ∆T is the difference in temperature, i.e., difference between deposition or stress free temperature and observation temperature in this case.
These characteristic can be found by solving four boundary value problems of the elasticity theory: uniaxial tension along the fiber length, transverse deformation in the plane normal to the fiber direction, shear deformation in the direction of the fiber axis and free temperature deformation.
By increasing the stretching parameter S will increase the skin friction (f 0)), while film thickness (beta=Upsilon^{frac{1}{2}}) decreases, but swing impact is detectable in both free temperature (theta(1)) and heat flux (-theta'(0)) when (K=0.1) as shown in Table 8.
The product material solidity prevents the free temperature deformation of its individual parts, resulting in the formation of stresses and plastic deformation of some parts of the joint metal during welding, and after cooling, welding stresses and deformations remain in the product.
The stresses showed good agreement with an elastic model with a stress-free temperature of 1600 °C.
Consider an infinite thermally conductive medium characterized by Fourier's law, in which a subdomain, called an inclusion, is subjected to a prescribed uniform heat flux-free temperature gradient.
The temperature sensor, which was formed by a long bent organic conductor-metal line, changes its resistance with temperature, has a resistance change sensitivity of 0.32% per degree of temperature change, and exhibits a hysteresis-free temperature sensing capability.
The results are presented in the form of buckling temperature change from the stress-free temperature (at which no stress is generated against the restraint) versus plate aspect ratio curves festooned for different buckling mode shapes for all laminates.
Out-of-phase BiF tests are strain-controlled fatigue tests whereby a single cycle consists of an isothermal compressive half-cycle at the maximum temperature, followed by stress-free temperature change to the minimum temperature; the tensile half-cycle then occurs isothermally at the minimum temperature, followed by stress-free temperature change to the maximum temperature.
