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The analysis is based on resonators fabricated in a 2-μm gap SOI-MEMS foundry process.
Several DSBC devices along with conventional body contact (CBC) structures are laid out using 0.35 μm SOI MOSFET foundry process.
Foundry process is a complex process with more than 100 parameters that influence the quality of final cast component.
The sensor is designed for a high volume commercial foundry process, and the bonded photo acoustic cells are suitable for large-scale production.
The devices were microfabricated using MCNC's MUMPs foundry process as well as a bulk-micromachining process called PennSOIL (Penn silicon-on-insulator layer).
The simulation of microstructure and mechanical properties is of great importance as a lead in bringing the foundry process and cast materials closer to the casting designer.
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A pH sensitivity of 20 mV/pH was achieved without modification to the foundry processed chip.
The stereoscopic visualization of full-size of product in the immersive casting simulation environment as well as the virtual X-ray images of castings provides an effective tool for design and evaluation of foundry processes by engineers and metallurgists.
Automation of foundry processes and above all modern machines have reduced the occurrence of some of the discrepancies.
A numerical model of foundry filling process was established based on the smoothed particle hydrodynamics (SPH) method.
This paper details the design and enhanced electrical transduction of a bulk acoustic mode resonator fabricated in a commercial foundry MEMS process utilizing 2.5 μm gaps.
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