This corresponds to an aspect ratio of ∼5 for thickness reductions larger than ϕ ⩾ 2, which is about two times larger in comparison with a HPT processed sample.
The structural response to impact loading conditions under normative requirements was properly related to the potential of lightweight design for a significant thickness reduction.
A value of ≈11% was obtained for the relative thickness reduction, strongly indicating the possibility of energy dissipation by the core, most probably due to crushing of the cellular structure of cork.
A three pass flow forming sequence was followed and the properties are measured for about 88 90% thickness reduction.
The latter represents the proposed design methodology, which led to a 15% reduction in asphalt thickness and a 10% thickness reduction for the stabilised course.
For larger thickness reductions the length of the major axis remained almost constant (Fig. 4a).
The observed thickness reduction mainly for the GaN QW can be explained by the following [23, 24]: (i) the Al-N binding energy is much higher than the Ga-N binding energy, (ii) the exchange between the Ga atoms of the QW and the Al adatoms of the barrier is thermally activated, and (iii) the strain in the GaN QWs influences the Al-Ga exchange mechanism.
The resulting films maintained their porosity (index) with less than 10% film thickness reduction, which was accounted for in the initial thickness estimation for films produced.
Coreless embedded trace has attracted interest from mobile device, in few metal layer Flip-Chip Chip Scale Package (FCCSP) substrate design, for electrical performance, high density, and thickness reduction.
The annealing processes of deformation-induced defects after cold-rolling to about 30 and 60% thickness reduction were investigated for Ag21, 23, 28 at% Zn by means of residual electrical resistivity, microhardness, light microscopy and transmission electron microscopy (TEM).
