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Electromigration (EM) is the major failure mechanism for interconnect reliability.
Implications of the model to wafer scale plating of Cu for interconnect applications are discussed.
For interconnect trees, the maximum improvement in delay for optimally placed interplane vias is 19%.
Today EM is the most significant threat for interconnect reliability in high performance integrated circuits.
These results show that the nanocomposites would be used instead of Cu thin film for interconnect applications.
A negative thermal coefficient of resistance was observed of −800 ppm/K, which is advantageous for interconnect applications.
Similar(35)
Recently, these models have evolved to consider interconnect issues, such as placement and routing for interconnect-dominated circuits, interconnect delay, and crosstalk noise.
Miller, D. A. B. Energy consumption in optical modulators for interconnects.
He held more than a dozen patents, in addition to the one for interconnecting circuitry.
An important section deals with fWLR for interconnects.
Corner suites allow for interconnecting rooms with views of the Acropolis, and there is a rooftop swimming pool.
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