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Compared to the conventional surface finish process sequence, the proposed sequence shows superior processing efficiency and quality for sapphire wafers.
A novel surface finish process sequence has been developed with a sequential process employing sol-gel (SG) semi-fixed abrasive polishing tool and gas-liquid assisted chemical mechanical polishing (GLA-CMP) instead of general copper-resin lap or plate (CP) and chemical mechanical polishing (CMP) to enhance the surface finishing efficiency for sapphire wafer.
This would be achieved by delaying the finishing process, no longer going clone-by-clone to shotgun, reassemble, and finish the sequence of one clone before proceeding to the next.
Ball end Magnetorheological Finishing (BEMRF) is a novel finishing process employed in the finishing of 2D and 3D surfaces.
Initiate the finishing process.
Other modern finishing processes include mothproofing of wool, often performed in the dyeing sequence, and application of soil-resistant finishes to man-made pile, rot-proofing, and antistatic treatment.
This leads to necessary finishing processes.
Some of these features can present major problems during the sequence-finishing process; the most common being gaps (missing sequence) of various types and characteristics, and sequence misassemblies.
Combining the Sanger- and Genome Analyzer-derived shotgun sequence data simplified some of the sequence-finishing process, but did not solve the most vexing finishing problems.
For these reasons, the number of gaps in an assembled sequence is a critical parameter for the sequence-finishing process.
In generating these BAC sequences, we have paid considerable attention to the sequence-finishing process.
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