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In this way, petroleum deposits came to be trapped by geologic features caused by the folding, faulting, and erosion of the Earth's crust.
Results show interesting features caused by the TS and the heliosheath which differ markedly for the two polarity cycles, with energy and with increasing solar activity.
The approach using a transformation matrix is proposed to determine the geometric deviations of mating features caused by the tolerance and assembly clearance, and the resulting propagation and accumulations in the different assembly sequences.
BEM-CFD can reasonably reflect the circumferential averaged velocity characteristics near the rotor for the optimal condition (TSR = 6) and gets symmetrical features in the wake, but it cannot predict the detailed flow features caused by the finite number of blades due to the limitations of the BEM-CFD method.
This report summarizes geotechnical and structural damage features caused by the earthquake, which were observed during a field investigation conducted by a survey team dispatched by the Japan Geotechnical Society (JGS), the Asian Technical Committee of ISSMGE on Geotechnical Natural Hazards (ATC3) and the Japan Society of Civil Engineers JSCEE).
The acoustic mismatch between clean reference features and noisy test features caused by the environmental noise produces a statistical difference between their corresponding probability density functions (PDFs) [21].
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The design challenge of SPSV lies in its necessary for single-phase power calculation to generate an average value of active/reactive power and the high order system feature caused by the virtual inertia element.
The drag force and vortex feature caused by the nonlinear wave current structure interaction are, respectively, numerically simulated with various high Reynolds numbers.
The difference between low-level feature and high-level semantic feature, caused by the absence of a direct relationship between low-level features and high-level concepts [9 13], is called the "semantic gap" [7].
In the case of pre-patterned wafers no cracks appear around the features, however we observed unsatisfied development within the resist features caused by insufficient solidification in the deep etch pits during Soft Bake.
Thus, the nightside images reveal features caused by differences in opacity of the upper portions of the cloud layer and refer to the mid- and lower levels illuminated by radiation from the lower levels of the atmosphere at 1.74, 2.26 and 2.32 µm.
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Justyna Jupowicz-Kozak
CEO of Professional Science Editing for Scientists @ prosciediting.com