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For example, for typical top-down fabrication such as 193-nm lithography or electron beam lithography, the thickness of PR is required to be as thin as possible in order to improve lithography resolution and at the same time to avoid the pattern collapse of PR [18].
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Examples for typical "offences" are hard to come by.
Application examples for typical non-linear wave interaction problems are given.
Finally, two examples for typical CFD applications for nuclear safety analyses are given.
Examples for typical high-and low-activity years are given in Fig. 3.
Examples for typical findings for each assessment are shown in Figure S1 in Additional file 1.
The package includes a 'vignette' with step-by-step examples for typical work flows.
Examples for typical L1CAM and AR stainings are shown in Figure 4B.
The package vignette (available at http://www.bioconductor.org/packages/release/bioc/vignettes/QuasR/inst/doc/QuasR.pdf) contains more details on QuasR functions, as well as step-by-step examples for typical analysis tasks.
Example calculations for typical power plant parameters are given.
For example, for a typical value of n F = 7, there are n P = 28 products.
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