Sentence examples for etch the silicon from inspiring English sources

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Then, a reactive-ion etching technology was used to etch the silicon nitride and a deep reactive-ion etching was conducted to form rectangular micro channel and micro-pillars.

A 3 minute reactive ion etching in CF4/O2 mixture was performed to etch the silicon nitride layer, until exposing the top of the nanotubes layer.

The transfer of a nanoporous pattern of anodic porous alumina into a silicon substrate was attempted to etch the silicon substrate by metal-assisted chemical etching.

Subsequently, KOH was diluted to isotropically etch the silicon wafer to form a surface with a pyramid texture [13].

Subsequently, KOH was diluted to isotropically etch the silicon wafer to form a surface with a pyramid texture [16].

To produce an array of silicon nanostructures, we etch the silicon substrate in an inductively coupled plasma, Tegal AMS 110 DRIE system.

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This was attributed to the fact that when the etching process started, the HF solution etches the silicon substrate leading to an increase of the SiNWs' length.

A low-cost plasma process technique for fabrication of electrode grooves on solar cells, in which the surface discharge operated at atmospheric pressure etched the silicon nitride film, was examined.

Moreover, even if silver ions initially manage to attach themselves to the surface, as the etching progresses, it becomes increasingly difficult to replenish the etching solution to etch the oxidized silicon layer (SiO2) under the attached silver particles on the silicon through the silver dendrites that cling to the surface and spread over the whole silicon substrate.

Reactive ion etching was employed to etch the template silicon layer along these boundaries followed by a wet etch in 49% hydrofluoric acid for 4 h to dissolve the underlying SiO2 layer.

As the etched pores do not reach the back face of the silicon wafer, a standard micromachining technique is employed to etch the excess silicon from the back face and reach the pore tips.

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