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Another experiment was to wet etch the sample in an undiluted gold etchant and measure its LSPR spectra at different etching intervals to control the etching process.
The first experiment was to perform all the lithographic steps above on a blank wafer without any mask exposure, remove the resist normally, and then, etch the sample by MACE.
Ar ion gun (5 keV) was employed to etch the sample in order to perform chemical depth profiling (results are not shown here), in order for the boundary of ZrO2 and IL to be identified.
For the cross-sectional images, a glass etcher was used to etch the sample on the side opposite the thin polymer film, and patterned polymers were then fractured and mounted vertically on the specimen stages.
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Subsequently, a mixture of SF6 and O2 was used to etch the samples at a working pressure of 25 mTorr for various durations to form the SiGe/Si MQW nanorod arrays.
Once the macropores were etched, the sample was thermally oxidized.
Once the macropores were etched, the samples were rinsed and dried.
After the surface compositional analysis, we etched the samples in the XPS chamber and obtained a bulk scan.
The results indicate that the monocrystalline quartz consists of pure SiO2 and its crystal plane is Before the fabrication, the quartz samples were ultrasonically cleaned in methanol, ethanol and deionized water for 10 min. To etch the quartz sample, a KOH solution (20% in weight) was prepared using solid KOH (analytical purity) and deionized water.
The results indicated that HF solution could selectively etch the scratched Si/Si3N4 sample.
The method was to etch the machined and damage-free samples in the same environment simultaneously, and then to compute the differential-rate.
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