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At the end of deposition process, all the deposited substrates were removed from the chemical bath at suitable intervals (4 to 24 h) and then washed with deionized water and methanol to remove the loosely adhered CdSe nanoparticles on the film.
The film substrate system becomes rapidly stabilized at the end of deposition.
During Paleocene, the basin continued to a shallow depression and the end of deposition of the Olpad formation is marked by a prominent unconformity.
The columnar grain size of CVD W at the end of deposition is approximately 20 50 μm in the direction parallel to the substrate and 1 1.5 mm in the direction perpendicular to the substrate.
Temporal evolution of temperature after the end of deposition revealed phase change in solid-state from β-Ti to α-Ti at 882 °C and, for the case of high average pulse currents, also solidification at 1670 °C.
The concentrated AgNW/IPA suspension was injected between the deposition plate and the Au film contacted at an angle of θ = 30°, and a meniscus was formed between the end of deposition plate and the Au surfaces due to capillary action (Fig. 1a).
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At the end of the deposition process, all the deposited substrates were removed from the chemical bath at suitable intervals (4 to 24 h) and were washed with deionized water and methanol to remove the loosely adhering CdSe nanoparticles on the film.
From the deposition of the Es 4 x sub-member to 44 Ma before the present (the end of the deposition of Es 4 s ), the top boundary of the Es 4 x was buried to a depth shallower than 750 m at formation temperatures below 50 °C, and the bottom boundary was buried less than 1400 m at temperatures below 75°CC.
All ALD ZnO films were terminated with the oxygen plasma cycle at the end of each deposition.
At the end of the deposition process, a tensile stress with small magnitude was obtained within the alumina coating.
Simulation results demonstrate that the proposed controller and patterned actuator design successfully regulate aggregate surface roughness and slope to set-point values at the end of the deposition.
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