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Exact(2)
In the design of electronic packagings, the stress concentration near free edges which may lead to the failure or malfunction of electronic assemblies and packages should be taken into account in detail.
Dendrites growth is a result of electrochemical migration (ECM) process, which is another factor affecting soldering reliability for electronic packagings, it was carried out as a designed schematic diagram coupled with a direct current power supply.
Similar(58)
The model could be used for engineering designs of vibration-impact isolation of electronic-packaging components.
A microstructure oil-damping shock absorber was designed for the protection of electronic-packaging components in vibration-impact environments.
In order to utilize these optoelectronics devices in electronic products, 3D-packaging as well as wafer level packaging (WLP) are needed.
Electronic ones.
Private electronic exchanges.
No fucking electronic stuff!
"Electronic voice phenomena".
Electronic rhino included.
Electronic transfers are banned.
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CEO of Professional Science Editing for Scientists @ prosciediting.com