Silver palladium (Ag/Pd) nanocomposites are important for electronics and electronic packaging, such as hybrid microcircuits, multichip modules, packaging for integrated microcircuits and passive electronic components [31].
Lu, T.J., Evans, A.G., Hutchinson, J.W., " The effects of material properties on heat dissipation in high power electronics". Journal of Electronic Packaging, 120, 280-289 (1998).
Polymeric composites have the potential to replace current electronic packaging and improve thermal management of electronics to open the way for further size shrinkage.
This includes such topic areas as ionic and mixed conductors; actuators and sensors; boundary controlled devices; wireless communications; electronic packaging; dielectrics; ferroelectric memory devices; photonics; magnetic recording; oxide electronics and superconductivity, among others.
Solders serve as electrical and mechanical interconnects in electronic packaging.
Solder joints are extensively used in electronic packaging.
Thus, it can be high performance materials with potential applications for electronic packaging.
Electroless plated SiCp/Al composites with a high thermal conductivity are required for electronic packaging application.
This finding resolves several controversies in the literature on electronic packaging.
Solder joint failure is one of the most common failure modes for electronic packaging structure.
Glass is a promising substitute substrate material being evaluated for electronic packaging technology.
