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In the past, electromagnetic shielding has been mainly the only criteria considered in electronic enclosure design.
This paper focuses on the application of finite element analysis to design an electronic enclosure with improved impact resistance properties.
In this work, a computational fluid dynamics (CFD) model is developed to simulate moisture transfer into a typical electronic enclosure.
In the first attempt, an isothermal case is developed and compared against the well-known RC circuit analogy considering the behavior of an idealized electronic enclosure.
Thus, the objective of this paper is to build an in-house code based on the RC approach for simulating coupled heat and mass transport into a (closed) electronic enclosure.
In this study, the relative humidity (RH) and temperature inside an electronic enclosure exposed to harsh ambient conditions (relative humidity of 100% and cyclic temperature changes from 10to5050 (°C)) are studied by developing a full 3D finite element based CFD model.
Similar(54)
Electronic enclosures are used to shield electronic devices against EMI.
Thus, it is important to control the moisture content and the relative humidity inside electronic enclosures.
Composite and metallic electronic enclosures are explored and the best material is selected.
Air-cooled electronic enclosures often incorporate miniature centrifugal fans to maintain reliable component operating temperatures at a local level, while larger system level fans are used to simultaneously control the ambient temperature within the enclosure.
DecaBDE is used in high-impact polystyrene for electronic enclosures and as a flame retardant in upholstery textiles (Hardy 2002a).
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