However, with higher loadings, a shielding effectiveness of 60 dB has been achieved which makes the conducting composites a potential EMI shielding material for its application in encapsulation of electronic equipments in electronic and in high tech applications.
The studies focus on the change of geometric structures and electronic properties upon the encapsulation.
Transfer moulding is one of the popular processes to perform microchip encapsulation for electronic packages.
These pre-machined features can be stacked layer-by-layer to create pockets for the accommodation of fragile components, such as electronic circuitry, prior to encapsulation.
Silicon dioxide (SiO2) has great potential to be used for thin-film encapsulation for flexible electronic devices, but it easily peels off with a large thickness to fail encapsulation.
Epoxy Molding Compounds (EMCs), commonly based on epoxy resin, are used widely for encapsulation of chips in electronic devices for protection against mechanical, environmental, and chemical attack.
The glory of nanomaterials is imperative and stimulated its various dimensions in nano-electronics, analytical chemistry, photonics, drug delivery, bio encapsulation, data recording media, gas sensing, storage, electronic, optical, and mechanical devices [1 7].
Therencapsulationexpected that CNWs's electrofic properthes carbon chainolled artificially by filling carbon chains with various densities of atomayinto the nanotubes.
c Pressure sensors made with MEMS technology and electronic components providing signal conditioning, power management and radio frequency transmission are encapsulated in glass encapsulation devices (Reproduced with permission from Ref. [53], Copyright © 2012 by the American Society for Artificial Internal Organs) Fig. 9 a Pictures of devices implanted in the left ventricular apex.
