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The effects of the plating current density (j) on the electroplated Cu microstructure, impurity distribution, and the solderability of the electroplated Cu were investigated.
Alloy deposits of Sn Bi were electroplated on Cu in an organic sulphonate bath using direct or pulsed currents, and the effects of the plating parameters on the composition and microstructure of the electrodeposits were investigated.
We next assessed the effects of the plating density and RANKL treatment on the long-term osteoclast dynamics in non-oscillating and oscillating groups.
Similar(57)
The present analysis also includes effects of the plate thickness.
The effects of the plate mechanical properties on the vibration amplitude and sound radiation were investigated.
The effects of the plate width and the mass ratio (i.e., the ratio of the length thickness and density ratios) on the critical reduced velocities are examined.
Grain forms appeared to have an influence on the void ratio, corroborated with the effects of the plates and the interference of the aggregates.
The effect of the plating parameters on microstructure and mechanical properties was investigated.
The effect of the plating time and temperature on the quality of Ni B coatings was estimated.
This paper investigated the detail effect of the plate spacing increments in the final total heat transfer area and total pressure drop design result.
The effect of the plate, used as a baffle, on suppression free surface waves is also considered.
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