Sentence examples for during the plating process from inspiring English sources
This triggers the polymerisation of the butylcyanoacrylate into a tough plastic, which forms the outside of the capsule.The greatest challenge for the team, however, was not making the capsules in the first place, but stabilising them during the plating process.
It is shown that the hydrogen desorption can occur not only when the electrodeposition is over, but also during the plating process.
Attenuated total reflection Fourier transformation infrared spectrometer (ATR-FT-IR), X-ray photoelectron spectroscopy (XPS), atomic force microscope (AFM) and scanning electron microscope (SEM) were employed to trace the surface change during the plating process.
Compared to PMA-qPCR, direct plating overestimated (P < 0.01) phage efficacy as cell surface-attached phage particles lysed E. coli O157 H7 during the plating process.
Consequently, PMA-qPCR could successfully solve the problem of overestimation of phage efficacy against E. coli O157 H7, which mostly arose as a result of the lyses of surviving E. coli O157 H7 by surface-attached phage particles during the plating process.
When E. coli O157 H7 cell suspensions treated with a phage were enumerated by plate count, cell numbers were substantially lower (P < 0.01) compared to estimates by PMA-qPCR, suggesting that either some cells in the mixture had reverted to a VBNC state or residual phages were lysing E. coli O157 H7 during the plating process.
A physical model that describes the role of osmosis during the electroless plating process is also developed.
In addition, the effects of magnet stirring and ultrasonic irradiation during the electroless plating process were compared.
The carbon/nitrogen ratio of the TiCxN1 − x coating was controlled by adjusting the composition of an additional acetylene/nitrogen mixture gas during the ion plating process.
Mercaptosilane covalently binds to the particle surface via hydrolysis and condensation reactions, while the mercapto group promotes a selective metal deposition during the electroless plating process due to its high affinity towards metal ions.
The interlayer on the substrate not only reduces the corrosion of magnesium during Ni P plating process, but also reduces the potential difference between the matrix and the second phase.
