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Allyl prepolymers cure during the imprint process as a result of heating.
Thereby, the hybrid template enables individual patterning by selective curing of the UV-curable imprint material during the imprint process and complete removal of the uncured residual layer areas in a single step.
The resulting transfer yield is shown as a function of (a) temperature during the imprint process, (b) applied gas pressure and the calculated effective pressure below the pillar structures, and (c) oxygen plasma pretreatment duration of the stamp (while keeping a constant substrate activation duration of 6 min).
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Firstly, the imprint process is realized in the AMONIL, which is deposited on a PMMA resist.
A comparison of the imprint mechanisms of the roller imprint and a vertical imprint case showed that the main high stress and strain regions were concentrated on the substrate atoms underneath and around the mold during the roller imprint process whereas these regions were concentrated only on the substrate atoms underneath the mold during the latter process.
It also discusses to which extent imprinted small RNAs might contribute to the imprinting process itself.
It is found that for each surface orientation, the mechanical properties of the patterned surface are deteriorated, due to the existence of defects generated during the direct imprint process.
Figure 6a plots variations of the imprint force with moving distance during the direct imprint processes of the two aluminum substrates with different orientations, which demonstrates that the two curves show similar characteristics as described in 'On the nature of direct imprint mechanisms' section.
The magnetic force can effectively increase the imprinting contact area of the roller and substrate during the roll imprinting process, while effectively enhancing roll imprinting velocity.
According to the simulation, the maximum imprint force in the vertical imprint process was smaller than that of the roller imprint.
Then, the force decreases rapidly and becomes zero at a moving distance of 3.2 nm, i.e., the residual imprint depth is 2.0 nm. Figure 3 Force-moving distance curve during the direct imprint simulation of Al 010). Figure 4a presents a three-dimensional view of the patterned structures formed on the Al 010) substrate after the direct imprint process.
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