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Part of the rise might have been due to bond markets' declining liquidity (see article).
Fragmentation is modeled as the separation of a cluster into disconnected pieces due to bond burnout.
Thus αth.exp (P) and αth.exp (T) are differently sensitive to the Sr and X ions in SrX (X = O, S, Se, and Te) lattice is mechanical hard due to bond strengthening and thermal soft due to bond weakening.
Thus, α th.exp.(P) and α th.exp.(T) are differently sensitive to the Si and C ions in 3C SiC ceramics as SiC lattice is mechanical hard due to bond strengthening and thermal soft due to bond weakening.
However, there have been reports of reduction in ductility associated with brittle behaviour due to bond failure and FRP rupture.
Thus, it can be concluded that all beam specimens failed due to bond failure and not due to rebar rupture.
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The volume change resulting from this bending, and the associated collapse of interpolyhedral spaces, is typically an order of magnitude greater than compression due to bond-length changes alone.
Due to bonding interactions, increased synergistic effects among antibiotics and nanoparticles were observed.
This results in formation of Au Ag nanocomposite due to bonding of the Au nanoparticles and Ag ions.
It seems that shifts in the position of CH2 and C-O stretching of DEG are due to bonding to Gd2O3 molecules.
The polymer composite is confirmed by the absence of peaks due to bonding of polymer polymer, Al2O3-polymer composite and Fe2O3-polymer composite.
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