Sentence examples for dissipation will be from inspiring English sources

For a given strain magnitude, the dissipation will be enhanced as the loading rate increases.

If the energy-efficient method is applied to the pipe inspection system, the energy dissipation will be decreased and the total time of performing a task will be increased.

However, the asymmetric features of the a subunit would make it the master regulator, thus directly determining which of the two functions, ATP production or ATP dissipation, will be performed.

Multifunctional PEI nanocomposites, in particular, with high damping properties and satisfactory static dissipation capability, will be more significant for those applications.

In such a configuration, the increase of the resonator quality factor with increasing wave amplitude (denoting a decrease of dissipation which will be referred to as self-induced transparency) has been observed indicating an important role of the amplitude-dependent losses introduced by the inter-surface contacts.

For the SLG fully supported on SiO2, adding Cu contact can effectively lower the temperature in SLG of small length, but the dominating heat dissipation pathway will be shifted from SLG/Cu interface to SLG/SiO2 interface as the SLG length increases.

A general conclusion is that the relative significance of the above two forms of gas dissipation will likely be dependent upon the scale at which the comparison is made.

Also, the inverse Fourier transform of the entransy dissipation rate in the frequency will be the extended entransy dissipation rate in the time domain.

In the supercritical case (0<alpha<frac{1}{2}), there will be less dissipation, so the dispersive part comes to play a principal role.

A recent analysis of Carnot's theorem has pointed out that the systems do not convert all the inflow energy to work and dissipation, but that some energy will be incorporated to internal processes.

On the technology side, the major challenges will be power dissipation and system cooling, low-cost and thermal-matched high-density interconnect substrates, as well as low-cost passive components integration.