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Fig. 9 Displacement evolution using image correlation in a sample of PBS under Hopkinson Bar Loading.
Displacement evolution with time and stress redistribution adopting different creep laws are presented.
In this paper, Moiré interferometry technique is used to measure the in situ displacement evolution of lead-free solder joint under electric current stressing.
In this paper, the Moiré interferometry technique is used to measure the in situ displacement evolution of lead-free solder joint under electric current stressing.
The deformational field analysis provided evidence of an ongoing rock block toppling (with an estimated volume of 450 m3), which displacement evolution reached values ranging from 12 to about 50 cm (Fig. 9b, c).
Then randomly fluctuating interface properties along the crack propagation path is considered to investigate the effect of variability on the force versus opening displacement evolution measured at a macroscopic scale.
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In particular, Infrared thermography (IR) and Digital Image Correlation (DIC), have been applied to analyze the cyclic temperature and displacement evolutions in the crack tip region of a commercial pseudoelastic alloy, together with the associated thermal and mechanical hysteresis, by using Single Edge Crack SECC) specimens.
b A snap shot of the voltage and total current during 60 μs, c a snap shot of the displacement current evolution during 60 μs, d discharge current spikes versus time Open image in new window Fig. 8 Instantaneous power.
The trajectory feet tracking was done accurately using a semi-analytic solution of the displacement gradient evolution equation and a weak formulation of the kinematics equation, the latter at the expense of solving an extra symmetric system of linear equations.
The mechanical behaviors and deformation mechanisms of scratched AlCrCuFeNi high entropy alloys (HEAs) have been studied by molecular dynamics (MD) simulations, in terms of the scratching forces, atomic strain, atomic displacement, microstructural evolution and dislocation density.
With the objective of evaluating the performances of the system in terms of temperature, stress and displacement fields evolution during start-up and shutdown phases, an uncoupled thermomechanical transient analysis has been performed in close collaboration with the University of Palermo by means of a qualified finite element (FE) thermomechanical code.
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