Your English writing platform
Discover LudwigSuggestions(1)
Exact(60)
By image processing of dipping process based on Otsu's method, it was found that low-viscosity flux glue eliminates the micelle effectively, very low speed also leads to small micelle hidden between the bumps, and this small micelle and hidden phenomenon disappeared when the speed is ≥0.2 cm s−1.
Real-time curve indicates the dipping process.
The parameters of dipping process are controlled by motion controller.
The dipping process results in the formation of thicker films.
The dipping process was repeated for 6 times.
StepV is filling holes and calculating bump area, dipping process area, and dipping bump area.
The mixture was stirred for about an hour before it was used for SILAR dipping process.
However, from the literature, studies on the dipping process are quite lacking.
Based on the experimental images and data, the dipping process is discussed further.
The dipping process was recorded quickly using FASTCAM-SA1.1 high-speed camera system.
Two-step spin-coating technology was then proposed to solve the problem occurred by dipping process.
Write better and faster with AI suggestions while staying true to your unique style.
Since I tried Ludwig back in 2017, I have been constantly using it in both editing and translation. Ever since, I suggest it to my translators at ProSciEditing.

Justyna Jupowicz-Kozak
CEO of Professional Science Editing for Scientists @ prosciediting.com