So far there was no research on the Cu-to-Si diffusion issue in Cu wire bonding.
The process takes advantage of the temperature window at which only the stereocomplex can grow and the homopolymers can no longer crystallize, and develops a feasible way to overcome the molecular diffusion issue in the stereocomplex growth.
That fact usually contributed to the diffusion issue of carbon feedstock molecules through the mat of CNTs [31].
A film thickness of less than 1 mm was required to ensure proper oil air interaction and to eliminate any gas-diffusion issues.
There are kinetic, heat transfer, and diffusion-related issues in a bulk polymerization process that make it difficult to develop and design processing methods that result in high molecular weight polymer at high throughputs with a high conversion of the monomer.
A typical case is of biomaterials made of NiTi, in which the main drawback is the Ni out-diffusion, an issue that has been satisfactorily addressed by plasma based ion implantation (PBII).
So, this study proposed a comprehensive framework to identify dynamics of diffusion and adoption issues from four different perspectives, namely, innovativeness, social system, communication and time.
Despite a great deal of experimental and theoretical effort that has been devoted to the study of surface diffusion [9], many issues associated with surface diffusion in the systems with low energy barriers and/or low friction are still not well understood [15].
