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Dielectric analysis.
The relationship between molecular motion and temporal stability are studied by dielectric analysis.
The aim of this study is a new investigation into thermosetting resin cure by dielectric analysis.
The Dielectric Analysis (DEA) measurement proves the effective and real-time tracking of resin polymerization during laminate production.
The dielectric analysis showed that the properties variation was mainly due to average grain size and defect density.
Electrical conductivity and dielectric analysis indicated that the dielectric loss and the dielectric permittivity increased at room temperature.
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The average diffusivity, which was estimated using the dielectric analysis-based approach, decreased by several orders of magnitude during the curing process.
Dielectric thermal analysis and dynamic mechanical thermal analysis measurements have been used to probe the phase structure of the blends and identify the glass transition temperature.
The results obtained from dielectric thermal analysis (d.e.t.a).t.a
According to the dielectric spectra analysis (see Figure 3), the decrease of ER effect was considered to be due to the degradation of dielectric property.
The ER enhancement was interpreted by the dielectric spectra analysis; a larger dielectric loss enhancement and a faster rate of interfacial polarization were responsible for the higher ER activity of the PANI/titanate nanofiber-based suspension.
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