Sentence examples for devices and integrate from inspiring English sources

He believes PC makers are best positioned to build multiple devices and integrate them, if they can return to their engineering roots.

InCentive Capital, Sulzer's largest shareholder with 15percentt, said it wants to spin off the Sulzer Medica unit, which is Europe's biggest maker of orthopedic devices, and integrate the other units before selling them as well.

Horizontally aligned single-walled carbon nanotube (SWNT) arrays are of great importance for building nanoelectronics devices and integrate circuits.

This is advisable for the designing and building future molecular logic devices and integrated circuits.

However, Audible will be phasing out the MobilePlayer in exchange for downloading content on Windows CE devices and integrating their software with PCs.

An IoT platform is a technology that sets the network standards and data sources of various devices, and integrates them regionally and internationally.

Silicon-based electronics expanded rapidly into many branches: discrete devices and integrated circuits, power applications, central processing unit (CPU) and microprocessor unit (MPU), and memories.

Ferroelectric field-effect transistor (FeFET) is a promising candidate for nonvolatile memory devices and integrated circuits because of its high speed, single device structure, low power consumption and nondestructive read-out operation [1 3].

Whereas the main industry in Tokyo is the service industry, in Kyoto, the main industries are manufacturing industries, including the automotive industry, the food industry, industries producing semiconductor devices and integrated circuits, and the publishing and printing industries.

It could compete with Facebook Messenger by pre-installing its own unified messenger app in the place of a standard SMS app on Android devices, and integrating that app with Chrome OS.

Self-heating in silicon-on-insulator (SOI) MOSFETs has become one of the vital issues for design, characterization, optimization and reliability prediction of SOI devices and integrated circuits due to the low thermal conductive buried oxide (BOX) and the continual increase in the microelectronic packaging density.