The concept of "two-layered" in this article means the Device Layer and Process Layer, as shown in Figure 1. Figure 1 Integrating lagacy device into business via two layer approach: device and process layers.
Fixed product design dissolved in favor of a layered modular architecture (i.e. contents, service, network, and device layer) and the process of value creation changed fundamentally from linear-oriented sequential value chains to complex value networks.
The device layer contains a number of energy storage systems.
The components are fabricated using a single silicon device layer.
The green indicates etched regions, while the remaining device layer is shown in pink.
The SOI device layer is patterned with the first UV mask using standard UV lithography.
A 3-μm-thick top device layer of SOI wafer is used to fabricate gate structures.
The actuators of the device layer ultimately complete the process of control.
In the device layer, there are PCS, battery devices, and power distribution cabinets.
The wafer is etched through the device layer to the BOX using ICP-RIE process.
